Design of ICs for flip-chip integration with optoelectronic device arrays

Hybrid integration of optoelectronic devices, such as GaAs MQW modulators, to CMOS VLSI circuits provides the opportunity to design ICs that integrate millions of transistors and thousands of high-speed optical I/Os for high-performance computing and switching applications. One of the challenges in designing such large-scale ICs lies in the development of an efficient method for integrating existing VLSI circuit layouts with two-dimensional arrays of optoelectronic devices. This paper presents several such methods and describes their application.