Major achievements of the NANOPACK project

NANOPACK-Nano Packaging Technology for Interconnect and Heat Dissipation- is a European large-scale integrating project aiming at the development of new technologies and materials for low thermal resistance interfaces and electrical interconnects, by exploring the capabilities offered by nanotechnologies such as carbon nanotubes, nanoparticles and nano-structured surfaces, and by using different enhancing contact formation mechanisms, compatible with high volume manufacturing technologies. Major achievements of the project will be presented, in particular in the fields of low resistance thermal interface materials, their modeling and their characterization.