Advanced polymers for advanced RF packaging applications

This paper presents advanced polymers for RF packaging applications including filters and antennas. First, micro-scaled LCP technology for front-end modules is presented. Next, nano-scaled ultra-thin RXP technology is introduced with its integration capability and embedded passive performances. Simulated results of bandpass filter, and antennas for 60 GHz are also presented in this paper. RXP technology provides low cost and promising high performance solution for wireless applications operating around microwave and millimeter frequencies. Magneto-dielectric substrates are proposed for effective miniaturization of antennas.