Abstract:
This paper presents an innovative 60 GHz substrate integrated transceiver system with a broad bandwidth up to 3 GHz. To validate the proposed substrate integrated circuit...Show MoreMetadata
Abstract:
This paper presents an innovative 60 GHz substrate integrated transceiver system with a broad bandwidth up to 3 GHz. To validate the proposed substrate integrated circuits (SICs) scheme, a 60 GHz wireless communication system with modulated signals is successfully demonstrated for line-of-sight (LOS) channels. The proposed integration technique of planar and non-planar structures allows the design of passive components and active devices within a single package. The passive circuits and high-gain antennas are integrated together with monolithic microwave integrated circuits by simple wire-bonding process. With this design and implementation technique, our 60 GHz transceiver system can demonstrate attractive advantages and features such as low-cost, compact size, low profile and reliable performances.
Published in: The 3rd European Wireless Technology Conference
Date of Conference: 27-28 September 2010
Date Added to IEEE Xplore: 01 November 2010
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Conference Location: Paris, France