A monolithic visible, infrared and terahertz 2D detector

A monolithic multispectral detector for imaging in the visible (VIS), infrared (IR) and terahertz (THz) ranges has been designed for operation at room temperature. This sensor is composed of a CMOS readout integrated circuit (ROIC) housing visible photodiodes and of IR and THz microbolometer pixels processed above the CMOS wafer. Without package- and system-level issues, targeted individual pixel sensitivities are respectively an 80dB dynamic range for VIS photodiodes, a NETD=50mK @f/1 for IR and a THz NEP smaller than 10pW. Prototyping chips will be integrated in tri-spectral imaging and THz spectroscopy demonstration systems.