Study on heat dissipation in Package-on-Package (POP)

Higher packaging density is driven by the multi-functional requirements and size shrinkage in handheld applications, which was greatly improved by the 3D packaging technologies. Package-on-package (POP) is one of the 3D packaging solutions. In the POP, the package components can be fully tested good prior to integration. However, the structure of POP is much more complex than that of single package and the effects of different components in POP integration need further research during thermal processes, e.g. POP working state or critical temperature environments. The thermal performance estimation relies on the prediction of temperature fields in the POP. A typical type of Package-on-package (POP) combing memory-die and logic-die packages was analyzed by finite element method in this study. The quarter 3D model was built up by ANSYS. The temperature field in the POP under its working state was simulated by considering the thermal convection between the device's outer surfaces and the air nearby. To understand the effect of components on thermal dissipation, the parametric analysis was performed intensively. The computational results showed the trend of temperature with different material properties. The POP design suggestions were achieved finally.