Dielectric composite material with enhanced thermal conductivity used for electronic packaging

The current trend in the integration and miniaturization of high-power electronic components requires a dielectric material with high thermal conductivity, which can conduct fast heat dissipation to prevent the circuit and substrate from overheating. Adding ceramic powders with a high thermal conductivity into the polymer is an effective way to enhance the thermal conductivity of the dielectric material. In our research, Halogen-free bisphenol-A epoxy and aluminum nitride (AlN) were chosen as the matrix and filler, respectively. The impact of AlN content on the thermal and insulating properties of the composites were investigated. A high thermal conductivity of 2.10 W/(m·K) was achieved with an AlN content of 55.9 % and a dielectric strength of 10–11 kV/mm was obtained. The viscosity of pre-curing suspension was also measured and the experimental data showed that the viscosity dramatically increased at an AlN content of 40%.