Design and technology of flip chip and SMD devices integrated with LTCC module

Electrical circuit design and technology of flip chip audio amplifier integrated with LTCC module are presented in the paper. Electrical circuit layout was miniaturized. Interconnections reliability between chip and substrate were increased with special underfill. Bonding quality was analyzed with X-Ray inspection. All electronic components were encapsulated with special ceramic housing. Additionally technology of LTCC modules integrated with RF transmitters and receivers are presented in the paper.