Design and implementation of a LTCC-based receiver front-end module

A S-band receiver front-end module using Low Temperature Co-fired Ceramic technology is presented to be small and reliable with the main passive components such as splitter, coupler, bandpass filter, resistors and capacitors embedded in LTCC substrates. The MCM-level module with a dimension of 27mm×25mm×1.9mm, realized in interconnecting the active chips by micro-assembly technology, is shown to meet the requirements quite well in experimental test.