Effects of shorting pin on the Substrate Integrated Cylindrical Cavity

Substrate Integrated Cylindrical Cavity (SICC) can be used to design compact planar circuits. For the same size, SICC loaded with shorting pin can resonate at higher frequency than no shorting pin SICC. This property can be used to implement the millimeter wave circuits. In this paper, the effects of shorting pin on SICC are analyzed theoretically. With the help of electromagnetic simulation software, the effects of shorting pin position, radius and number on the resonant frequency of SICC are studied. Some results and conclusions are given in the paper, they will be useful for the SICC based millimeter wave device design.