Fabrication and characterization of 200-nm self-aligned In0.53Ga0.47As MOSFET

In this paper, a 200 nm n-channel inversion-type self-aligned In
_0.53
Ga
_0.47
As MOSFET with a Al
₂
O
₃
gate oxide deposited by Atomic Layer Deposition (ALD) is demonstrated. Two ion implantation processes using silicon nitride side-wall are performed for the fabrication of the n-type source and drain regions. The 200 nm gate-length MOSFET with a gate oxide thickness of 8 nm features the transconductance of 70 mS/mm and the maximum drain current of 200 mA/mm.