Research of etching a novel MEMS gyroscope sensing pendulum

A novel MEMS gyroscope sensing pendulum was etched with KOH by isothermal magnetic stirrer, and the etching rate relation with temperature and concentration was investigated in the mask of SiO
₂
. The results reveal that a rate of etching Si(100), Si(100) to SiO
₂
and Si(100) to Si(111) is 4.0 μm/min, 550:1 and 90:1 respectively, a uniformity etching surface and ideal etching rate are obtained for a concentration of 30%KOH at 110°C, meet the production of MEMS gyroscope requirements.