High-speed test hardware full path measurement using low loss PCB substrate

High-speed Input/Output (I/O) measurements are crucial to ensure good signal integrity performances in High-speed interfaces. Modeling effects enable minimization of the throughput time from design, development and ultimately products to market. However, modeling needs validations to cross check the accuracy. Full path measurement is recommended to validate the performance of components within the channel by cascading them together. This paper introduces the advantages of replacing ceramic surrogate package with a low loss substrate, namely Roger 4350B. Basic concept and measurement setup in Functional/Structural Test and System Test will be explained.