Robust analysis of the active disassembly process

This paper explores a means to control the active disassembly (AD) process for designed and manufactured heat-activated shape memory polymer snap-fits. Testing was performed for demonstration of the active release of the SMP snap-fits and for analysis of AD control factors. Robust design methodologies with Taguchi methods were used to analyze the AD process factors, including heating method and disassembly temperature. The results from this research show the successful demonstration of the SMP snap-fits. AD process analysis shows that both the heating method and temperature affect the AD process. The analysis determines that by increasing the heat exchange rate the snap-fit disassembly time is shortened. From the performed experiments, it was seen that an Oil bath at 150°C produced the best results in regards to disassembly time and signal-noise ratio.