Localized SOI logic and bulk I/O devices co-integration for Low power System-on-Chip technology

The objective of this paper is to present the successful co-integration of Logic Ultra-Thin Body and Box (UTBB) devices and bulk-Si I/O devices on the same chip. The UTBB transistors are integrated locally on a Bulk wafer with the Localized Silicon On Insulator (LSOI) process technology with HfO
₂
/TiN gate stack for low power applications. I/O co-integrated Bulk devices have a thicker interfacial SiO
₂
under the HfO
₂
/TiN stack to be compatible with the I/O higher voltage. Both performances of logic UTBB and I/O bulk devices are presented.