Reliability and degradation mechanism of AlGaN/GaN HEMTs for next generation mobile communication systems

Excellent reliability performance of AlGaN/GaN HEMTs on SiC substrates for next generation mobile communication systems has been demonstrated using DC and RF stress tests on 8x60 μm wide and 0.5 μm long AlGaN/GaN HEMTs at a drain voltage of V
_d
=50V. Drain current recovery measurements after stress indicate that the degradation is partly caused by slow traps generated in the SiN passivation or in the HEMT epitaxial layers. The traps in the SiN passivation layer were characterized using high and low frequency capacitance voltage (CV) measurements of MIS test structures on thick lightly doped GaN layers.