Integration, cooling and packaging issues for aerospace equipments

Packaging becomes an important issue in aerospace equipments because of high integration and severe environmental constraints. In order to develop products which respond to the specifications at a minimum cost, Thales performs both mechanical and thermal simulations. The simulation level depends on the phases of design (preliminary or detailed). The major challenges are encountered on thermal management problems with power higher than 100 W at the module level and with local hot spot greater to 100 W/cm
²
. Under these conditions, standard cooling approaches using forced air are no longer applicable. To challenge these points Thales has launched European collaboration research programs: ¿COSEE¿ for the development of two phases cooling systems and ¿NANOPACK¿ for the development of thermal interface materials.