Performance of any layer IVH structure multi-layered printed wiring board

We have developed a new multi-layered printed wiring board (ML-PWB) with any layer IVH structure, dubbed "ALIVH"(Any Layer Inner Via Hole). This ALIVH design combines epoxy impregnated non-woven aramid laminates, via hole processing technology using a CO/sub 2/ laser and interconnection technology using conductive copper paste. Non-woven aramid made of extra strong and high thermal resistant aramid fiber has low dielectric constant and is light weight. Non-woven aramid laminates has excellent flatness and low thermal expansion coefficiency in plane. Therefore, ALIVH has a great potential to cope with flip chip bonding technology for MCM-L applications.