Multiple attachment GaAs-on-Si hybrid optoelectronic/VLSI chips

For several years we have been developing an optoelectronic/VLSI (OE/VLSI) chip technology based on flipchip bonding of GaAs optoelectronic chips onto CMOS silicon followed by substrate removal. Our optoelectronic devices are currently surface normal modulators, which also function as the input detectors. Finally, we have demonstrated an OE/VLSI switching chip with >140000 CMOS gates and 4352 modulators that operated with a clock rate of 400 Mbit/sec.