Design rules to optimise the layout of the multilayer circuit packages at 60GHz

New practical design data have been obtained relating to the effects of coupling between conductors in highly integrated, multilayer circuits working at millimeter-wave frequencies. Data has been obtained on various cross-over and coupled line structures at 60 GHz. The practical circuits were fabricated using photoimageable thick-film technology. Design rules have been developed to provide guidance to the circuit designer on the minimum spacing between conductors in a multilayer package, thus achieving an optimum compromise between good isolation and minimum package size.