Test structure for thermal monitoring

The paper is dealing with thermal test structures for CMOS ICs. A new temperature sensor/test structure is proposed: the Thermal Feedback Oscillator (TFO). Detailed design considerations are presented together with experimental results. Moreover the paper discusses general questions of the "design for thermal testability" (DfTT) principle including both the problems of placement of the test structures and possible solutions for the read-out of the test data.