Thermal investigation of an infrared reflow furnace with a convection fan

A two-dimensional numerical model for an infrared reflow soldering with a convection fan is developed by modifying the Eftychiou's numerical modeling. The two-dimensional tunnel model which predicts convective conditions within the reflow oven are solved using the finite volume method with the SIMPLER algorithm. The card model solves the transient two-dimensional heat conduction equation in conjunction with a radiative heat transfer analysis. We also perform an experimental study to validate the numerical modeling. The numerical result shows excellent agreement with the experimental data. Based on the capability of this model, parametric simulations are performed to determine the thermal response of the solder to variations in the oven operating conditions and heat transfer conditions. This study shows that radiation and conveyor velocity are important factors at the preheat region.