Heat transfer and nonlinear thermal stress analysis of a convective surface mount package

Most prior heat transfer and thermal stress analyses of convective surface mount packages have relied on either an isothermal (constant temperature) model or a constant heat transfer coefficient thermal model. This usually leads to a concern for the accurate estimation of the local temperature distributions and the induced stresses. To release this concern, this paper presents the use of the finite element method in conjunction with a local heat transfer coefficient model in predicting the local temperature and stress distributions of a ceramic ball grid array (CBGA) package. A thermal boundary condition of the local heat transfer coefficient model was obtained from a previous computational fluid dynamics (CFD) solution. The analysis results are compared with that predicted by the isothermal model and the constant heat transfer coefficient model. Instances where the temperature dependent and elastic-plastic behavior are significant in some components of the modeled package are also examined.