Integrated micro heat sink based on microchannels microfabricated onto silicon

The paper presents the microfabrication technique of an integrated microsystem able to be used for power semiconductor devices air forced cooling. The paper studies the as obtained silicon microfluidic devices, their characteristics and applications. This technology for silicon surface microprocessing, uses a thick resist (>20 mum) as a sacrificial layer, and the micro-electroplating of a Cu thin film. The paper proposes the device electrical characterization on a specially designed test structure. This test structure comprises an integrated microsystem for cooling micro-processed directly onto the silicon wafer, Pt power resistance and Pt thermo-resistances.