Brazing to low-temperature-fired thick films

The development of materials and processes for brazing leads, pins, and heat sinks to alumina ceramic substrates is presented. The substrates are metallized using either copper-, silver-, or gold-based thick-film pastes that are fired in the 850-950 degrees C temperature range. The metal ceramic joint strengths obtained are comparable to those achieved using high-temperature fired tungsten- or molybdenum-based metallizations.<
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