Compression molding solutions for various high end package and cost savings for standard package applications

There has been great progress on compression molding technology and equipment. This technology is used not only for most advanced semiconductor package, but also regular BGA type substrate molding to reduce CoO. There is wide range of applications including LED production. The system for mass production is fully developed and is ready to support the production. Compression molding is the next Defacto standard product in mold industry.