Failure analysis of halide of epoxy molding compound used for electronic packing

As the continuously development of microelectronics industry, higher demand has been put forward toward the electronic packing technology. Being one of the three most important packaging materials (lead frame, spun gold, Epoxy Molding Compound) used for semiconductor, EMC has directly affected the performance of the semiconductor product. In this article, the transistor (model SOT32) was researched. Obtaining the packaging EMC of the transistor through the chemistry method, the elemental compositions of the EMC were analyzed by the scanning electron microscope (SEM) and the energy dispersive spectrum analysis (EDS). On discussing the differences in the microstructure and the elemental compositions between the failure and the qualified samples, the failure mechanism of the electronic components which was because of the halide of the EMC was lodged and the corresponding improve measures were discussed.