Study of thermal and electrical reliability on multi-chip module packaging for optical sensor

The equivalent circuit model for optical sensor with quantum dot quantum well hybrid structure is established to investigate the small signal characteristic further. The parasitical parameters are introduced to the equivalent circuit model of optical sensor to investigate the electrical reliability and the performance of optical detector. The 3D multi-chip module (3D-MCM) packaging models of FEA for optical sensor with quantum dot quantum well hybrid structure are established to obtain strain energy density (SED) and deformation to calculate fatigue life of solder joint under different geometrical and material properties by ANSYS. The indium bump model has been utilized to investigate the reliability of joints between optical sensor and readout circuit. ANSYS finite element models have been developed to analyze the effect of detector thickness, indium bump height, diameter and density on indium bump reliability. Moreover, the dummy indium bump is introduced to enhance the reliability of indium bump. The thermal-mechanical simulations are carried out on the assembly model in order to compute the thermal stress in solder joints and the whole package during thermal cycles.