FEM analysis of SnAgCu solder joint in flip chip

SnAgCu solder is fast becoming a reality in electronic manufacturing during to marketing and legislative pressure. This paper studies the thermal fatigue life of Flip Chip by the application of thermal fatigue life prediction model. The required life prediction model for SnAgCu solder joint is based on fatigue-creep interaction damage theory. In same test condition, the actual life of Flip Chip is earned from the other paper. The different between the actual life and prediction life will be compared, and the reason of difference will be analyzed.