An approach to measurement and evaluation of the thermal conductivity of the thermal adhesives in electronic packaging

In the following paper the measurement method of thermal conductivity is described. This method was especially designed for measuring the thermal conductivity of the thermal adhesives. The principal informations about heat transfer are given, and the experimental setup, mathematical model of experiment and its uncertainty with 95% of probability are shown. The thermal conductivity of polymer based material filled in 0.5% with carbon nanotubes is measured.