Pipe-shaped BiCS flash memory with 16 stacked layers and multi-level-cell operation for ultra high density storage devices | IEEE Conference Publication | IEEE Xplore

Pipe-shaped BiCS flash memory with 16 stacked layers and multi-level-cell operation for ultra high density storage devices


Abstract:

We propose pipe-shaped bit cost scalable (P-BiCS) flash memory which consists of pipe-shaped NAND strings folded like a u-shape instead of the straight-shape. P-BiCS flas...Show More

Abstract:

We propose pipe-shaped bit cost scalable (P-BiCS) flash memory which consists of pipe-shaped NAND strings folded like a u-shape instead of the straight-shape. P-BiCS flash technology achieves a highly reliable memory film of which the program and erase (P/E) operation is managed by Fowler-Nordheim (FN) tunneling, that is originated by the strong curvature effect of its small pipe radius, a low resistance source line by the layered metal wirings and a tightly controlled diffusion profile for the select-gate (SG) transistor due to low thermal budget. The effective 1-bit cell area of 0.00082 mum2 and its functionality are successfully demonstrated using the 32 Gbit test chip with the 3-dimensionally 16 stacked layers and the multi-level-cell (MLC) operation by 60 nm P-BiCS flash technology.
Date of Conference: 15-17 June 2009
Date Added to IEEE Xplore: 11 August 2009
Print ISBN:978-1-4244-3308-7

ISSN Information:

Conference Location: Kyoto, Japan

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