Alignable lift-off transfer of device arrays via a single polymeric carrier membrane

We report epitaxial liftoff and direct bonding of GaAs/Al/sub x/Ga/sub 1-x/As heterostructure device arrays and continuous films, using a single, transparent polymer membrane to support the material during the etch of the sacrificial layer and to manipulate it into position for bonding in minutes. Au-Sn eutectic alloy bonding leads to a metallurgical bond in minutes. Absorption and current-voltage characteristics show that the material quality is not substantially degraded in the transfer process.