Multi layer film adhesive for IC packaging applications

The adhesives have important functions in the recent IC packaging. The packages are more complex because of the trend of IC integration. For example, high thermal conductive adhesives are used for high power ULSIs. Stress insulating adhesives are used between two materials which have big difference in thermal expansion coefficient such as between metal heat sink and ceramics. From the general technical standpoint, in almost all cases, thermal conductivity and stress insulation are trade-off factors. Additionally, the adhesion strength and processability are also discussed as important functions. To develop materials which have high performance such as stress insulation with good thermal conductivity, multi layer functional film adhesives have been studied. The multilayer structure has made it possible to get high thermal conductive and low stress characteristics simultaneously with high adhesion.