New non-bias optical beam induced current (NB-OBIC) technique for evaluation of Al interconnects

A new technique, using a highly sensitive optical beam induced current (OBIC), has been developed for failure analysis of Al stripes and vias. The technique realizes the detection of point defects, such as voids in Al interconnects, with no application of voltage or removal of passivation layer being required. This non-bias OBIC (NB-OBIC) technique is very useful in the analysis of Al interconnect failures in actual LSIs.