Electrical design and characterization of Si interposer for system-in-package (SiP)

Si interposer technology has the potential to enable high-bandwidth and low-power image processing devices of the future, because a very high density system with an ultra-fine pitch (les5um) wiring can be fabricated. However, the ultra-fine pitch wiring may adversely affect the electrical performance of devices. This paper discusses the signal propagation properties of ultra-fine coplanar interconnects on Si interposers. A design chart of the interconnects, obtained from the viewpoint of maximum line length versus target operating frequency, is presented.