Post-dicing particle control for 3D stacked IC integration flows

The concept of 3D integration aims at low cost and high yield processes. For this reason, cleanliness is a concern in process steps such as bonding. However, preceding process steps like dicing and die-level handling are traditionally associated with high levels of contamination. Usually a clean prior to the bonding step will be required. We discuss the requirements of the cleaning process, and explore defect inspection and cryogenic cleaning as viable solutions.