Influence of an impedance step in interconnection inductance calculation

With increasing frequency and power integration in many power electronics applications, interconnection modeling becomes of great importance. The aim of this paper is to present how to take into account an impedance step in an interconnection track (solder pad for instance) using PEEC method (partial element equivalent circuit). The better way to decompose the discontinuity is studied, according to the frequency of interest. Results are compared to measurements, carried out on a printed circuit board (PCB) loop and to analytical resolution at low frequency.