IGBT power semiconductor reliability analysis for traction application

IGBT (Insulated Gate Bipolar Transistor) power semiconductor modules become of importance for traction applications. However, the reliability of these power modules is still a concern, compared to those of press-packed GTOs. Although first IGBT-press-pack solutions have been presented to the market, IGBT-presspacking remains difficult and expensive. Besides this, customers prefer module technology solutions, because of their economical advantage and easiness of device mounting. Reliability tests have been developed and modules have been analyzed to judge critical reliability points and to show ways for improvement.