Autocatalytic gold plating process for electronic packaging applications

An autocatalytic electroless gold process suitable for electronic packaging applications, particularly wirebonding needs, is described. This process yields high purity, nonporous soft gold of any thickness that meets or exceeds all military specifications. The process can be used for a wide variety of organic laminates (FR4, multifunctional epoxies), circuitized either subtractively or additively, in addition to ceramic substrates. A description of the process flow, bath parameters, bath performance, and resulting metallurgy will be described. The process acts as an excellent follow on to the conventional electroless nickel/immersion gold surface finishing systems currently practiced by the industry. Rate, purity, hardness, and wirebond data as a function of bath life (metal turnovers) will be discussed. The plating rate can be tuned between 1.5 and 2.5 /spl mu/m/h. The resulting deposit remains pure (>99.93%) and soft (<70 knoop) even in the presence of metallic impurities and upon bath aging. Wirebond data as a function of gold thickness and plating parameters win also be presented. The process also has the ability to uniformly plate fine lines (>50 /spl mu/m) separated by small spaces (>45 /spl mu/m) without loss of line definition or bridging. The bath exhibits excellent throwing power. Drilled PTHs with aspect ratios as high as 15:1 (hole diameter of 0.03 mm, length of 0.45 mm) can be uniformly plated.