Temperature and stress time history responses in electronic packaging

The closed-form thermoelasticity solutions of electronic packages subjected to an instantaneous source of heat, and a heat source varying harmonically as function of time, are presented. Useful curves and charts which relate the variables, time, frequency, heat, temperature, stress, displacement, and material property are also provided for engineering practice convenience. Also, the present results can be used to verify finite element analysis procedures and interpret experimental data.