Millimetre-wave Hot-Via interconnect-based GaAs chip-set for automotive RADAR and security sensors

New microwave front-ends are more and more integrated and operate commonly at very high frequencies above 40 GHz. So the chip to sub-system interconnections at millimetre-wave frequencies play as key factor to address the main system requirements which are generally a low cost, a high reliability level with of course the best electrical performances. UMS has developed a 77 GHz chip-set for automotive RADAR using a wire free connection called hot-via. This very broad band transition was optimised in W-band in order to remain compatible with the existing chip designs and to be realistic in term of industrialisation, cost and assembly in heterogeneous microwave sub-systems.