Analysis of the Vertical Electromagnetic Bandgap Structures in the Power Distribution Network for the Multi-layer Printed Circuit Board

In this paper, we demonstrate the suppression of the power distribution network (PDN) impedance in multi-layer Printed Circuit Board (PCB) using Electromagnetic Bandgap (EBG) structure. We, first, analyze the resonances for measured PDN impedance from 8-pairs of power/ground planes by correlation to the 2.5-dimensional field simulation results. Then, we demonstrate and discuss the effect of the EBG structures which are vertically located between the power and ground planes to provide the low impedance within the designed stopband. By comparing the measurement result of the test vehicle with vertical EBG structure to that of the test vehicle without vertical EBG structure, it is shown that, within the EBG stopband, from 11 GHz to 21 GHz, the PDN self impedance, Zl1 of the multi-layer power/ground planes is successfully suppressed.