Quasi-static lumped element stand-alone package model for quad flat package

A new type of package model is introduced, which allows to take into account the effect of external structures, such as PCB traces and ground plane, by limiting at the same time the disclosure of internal details of the package. The model is verified with a scaled quad flat package (QFP) and two different printed circuit board (PCB) patterns, but the general procedure should be applicable to other types of package.