Oasis cooling packaging technology for notebook computers

It is imperative that designers, OEMs and systems integrators address system-wide thermal issues, and do it from the earliest stages of product design. As this technique is practised, engineers will be working with a broader array of technologies and disciplines than ever before. Consumer demand for powerful, portable computing products is the major driving force for new thermal techniques, An example of one of these new techniques is a dual phase fluid cooling system.<
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