High frequency, low cost, power packaging using thin film power overlay technology

The improved performance of high power circuits are achieved using an innovative embedded chip MCM technology for power applications. This power package development is based upon an extension of a thin film MCM process which replaces the parasitic limiting wirebonds of hybrid power circuits and the package limiting SMT power circuits with low impedance, multilayer metal interconnects. This paper describes the thin film power overlay technology and how this package structure improves electrical, thermal, and reliability performance.<
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