High performance embedded RF passive device process integration

We report the process evaluation and integration for the embedded RF passive device in this paper. Two sets of test vehicle were designed and fabricated for the evaluation of RF passive devices embedded in USG (undoped silicate glass) and BCB (Benzocylcobutene) dielectric. We encountered resistor uniformity issue and BCB capacitor limitation during the process set up. After process issue solving and final platform setting, resistor, capacitor, inductor and bandpass filter were integrated and the high performance functions were demonstrated.