Development and performance characterizations of a QFN/HMT package

In this paper, application advantages, development, and fabrication process of aQFN/HMT is introduced. Identical functions are intentionally designed in both CSP- BGA and aQFN/HMT packaging structures so that thermal and electrical performances of these two structures can be reasonably compared and demonstrated. Our calculations indicate that thermal and electrical performances of aQFN/HMT are much better than CSP-BGA, when the same functions are designed in.