High temperature alternatives to ball grid coplanarity measurements to improve correlation to surface mount quality

For many years the primary means of ensuring surface mount (SMT) quality of components has been monitoring outgoing coplanarity at the component factory. This method has been embodied in a collection of JEDEC and other standards. While this approach is successful in general it has one primary limitation, it is measured at room temperature. The lack of correlation to SMT quality leads to issues for false failure and false acceptance. The former issue can negatively impact component costs and can impede innovation in new packaging technology. The latter issue may lead to poor yields in board assembly and product delays.