Process technology for the fabrication of a Chip-in-Wire style packaging

In this contribution, progress on Chip-in-Wire packaging will be presented. The basic principle behind this concept is that small chips are interconnected and embedded in a flexible (and possibly stretchable) material so that a resulting 1D array of interconnected dies can be formed. At the end of the process, the structures can be released so that a freestanding “wire” of interconnected chips is fabricated.