Realization of via interconnects based on Carbon Nanotubes

This work presents the integration of Carbon Nanotubes (CNT) in via structures for future microelectronic interconnect generations. It is focused on the optimization of the integration schemes to overcome integration issues such as localizing catalyst in the bottom of vias, enabling CNT growth on copper surface, and realizing metal connection on top of CNTs. Two different types of Multiwall-Carbon-Nanotubes (MWCNT), either forest of narrow MWCNTs grown by PECVD have been integrated in these structures. Morphological and electrical characterizations are presented.